Suzhou Sunshine Technology, a manufacturer of optical modules and connectors, utilizes advanced industrial X-ray inspection systems for non-destructive quality control. See how X-ray technology ensures internal integrity and detects defects in精密电子组件. Learn about their inspection solutions.

With the introduction of the Wahfei HF-S90 six-axis multifunctional X-ray inspection system, Ji’an Fuzhisheng now performs full-process, non-destructive penetration inspection on FPC assembly, significantly reducing the risk of batch rework caused by hidden defects and delivering IPC-compliant quality assurance for high-reliability industries such as consumer electronics and automotive electronics.

As Wahfei's most representative offline X-Ray inspection equipment, the HF-S90 has undergone four iterations over seven years. Each upgrade represents not just an improvement in appearance, but a comprehensive leap in performance, structure, and intelligence. For you, this means higher inspection accuracy, faster inspection speeds, and more stable production assurance.

To address the industry challenge of detecting internal defects in lithium batteries, Kaiyuan New Energy has introduced Wahfei X-Ray inspection equipment, enabling non-destructive imaging of internal battery structures, effectively reducing defect outflow rates and ensuring product safety and consistency.

With the accelerated adoption of third-generation semiconductors like silicon carbide (SiC) and gallium nitride (GaN), alongside the boom in new energy vehicles, photovoltaic energy storage, and AI data centers, the industry's demand for efficient and precise chip testing is continuously growing. From July 25th to 27th, 2025, the 19th China Semiconductor Discrete Devices Conference & Exhibition was held under the industry's spotlight. Wahfei Technology made a significant appearance, showcasing its independently developed full-stack X-Ray intelligent inspection solutions.

Simple operation allows even non-technical users to get started quickly. One-click detection identifies internal defects such as BGA solder joint failures, IGBT bubbles, and PCB solder bridges. Boost inspection efficiency with MES system integration to reduce scrap rates and labor costs.

Unlike the stacking effect of conventional radiographic images, 3D CT (Computed Tomography) technology uses 360-degree rotational imaging combined with algorithmic reconstruction to perform “layer-by-layer slicing” analysis of SiC wafers and power devices with micron-level precision.

Wahfei's X-Ray inspection system is specifically designed for this purpose. The system offers real-time, off-axis X-Ray imaging, specially tailored for the inspection of PCBA (Printed Circuit Board Assembly) and array-type devices. It is suitable for use both in production lines and in failure analysis laboratories. The sample can be rotated 360° and supports large tilt viewing angles; combined with an intuitive software interface, it enables operators to clearly observe and identify even the most challenging defect types.

For products such as SMD and FPC assemblies with complex structures and hidden solder joints,industrial X-ray inspection is no longer just a supplementary quality control method.It can be integrated as a core inspection process, enabling manufacturers to identify internal soldering defects before shipment and effectively reduce hidden quality risks.

Traditional inspection methods often rely on manual sampling or destructive unpacking. This is not only inefficient but also fails to cover every product leaving the factory. Especially for items with composite plastic and metal packaging, such as lipsticks and liquid lip tints, how to inspect the internal condition without opening, touching, or damaging the exterior has become an industry pain point. This is exactly where modern industrial X-ray inspection equipment comes into play. Leveraging the strong penetrative power and density resolution of X-rays, we can conduct a thorough “CT scan” of each product, examining it from the inside out.

X-Ray Testing System Real-Time Imaging Interface / High-Resolution X-Ray Imaging Clearly Reveals FPC Internal Structure

In the fields of electronics manufacturing, integrated circuit packaging, automotive parts, and precision casting inspection, X-Ray equipment has become a critical tool for quality control. However, many companies focus excessively on hardware parameters when purchasing equipment, while overlooking a core fact: under the same shooting conditions, image processing technology is the key factor that determines inspection results.