As Wahfei's most representative offline X-Ray inspection equipment, the HF-S90 has undergone four iterations over seven years. Each upgrade represents not just an improvement in appearance, but a comprehensive leap in performance, structure, and intelligence. For you, this means higher inspection accuracy, faster inspection speeds, and more stable production assurance.

To address the industry challenge of detecting internal defects in lithium batteries, Kaiyuan New Energy has introduced Wahfei X-Ray inspection equipment, enabling non-destructive imaging of internal battery structures, effectively reducing defect outflow rates and ensuring product safety and consistency.

With the accelerated adoption of third-generation semiconductors like silicon carbide (SiC) and gallium nitride (GaN), alongside the boom in new energy vehicles, photovoltaic energy storage, and AI data centers, the industry's demand for efficient and precise chip testing is continuously growing. From July 25th to 27th, 2025, the 19th China Semiconductor Discrete Devices Conference & Exhibition was held under the industry's spotlight. Wahfei Technology made a significant appearance, showcasing its independently developed full-stack X-Ray intelligent inspection solutions.

During the production of injection‑molded parts and metal power enclosures, foreign object contamination is often hidden and unpredictable, impacting both yield and safety. With high‑resolution imaging technology, metallic debris, plastic residue, assembly omissions, and other internal defects can be precisely located without cracking or damaging the sample structure, helping manufacturers identify risks in time and maintain stable production quality.

In the fields of electronics manufacturing, integrated circuit packaging, automotive parts, and precision casting inspection, X-Ray equipment has become a critical tool for quality control. However, many companies focus excessively on hardware parameters when purchasing equipment, while overlooking a core fact: under the same shooting conditions, image processing technology is the key factor that determines inspection results.

X-ray Determination of Common Defects and Countermeasures: Insufficient Solder Penetration (Shallow Fill): Increase preheat, adjust wave contact angle and time, optimize hole wall cleanliness. Internal Voids/Gas Entrapment: Reduce solder gas content, optimize flux volatilization path and nitrogen protection. Eccentric Wetting: Check pin centering and fixture positioning, perform hole chamfering/expand ring width if necessary.